We build the toolsfor future compute.

Why it matters: for fifty years this industry delivered improvements in performance per watt and per dollar through planar scaling. That era is ending. Moore's law can no longer rely on lithography alone; the blueprint is no longer the bottleneck. The constraint is now the materials stack itself.

Every chip is built in two steps: patterning and deposition. ASML turned patterning into a step change, and EUV now draws features at atomic scale. Deposition did not follow. High-volume deposition still runs on fifty-year-old physics. Push today's tools toward what the next node needs and the film stack breaks. They trade quality for speed. They contaminate what they deposit. They offer no precise control over how atoms land.

HallTech is building a new deposition platform from the specs the industry needs, designed backwards. Fast, high quality, at low temperature, with real control over the energy of the atoms as they land and the structure they form. We are making the materials the next generation of chips depends on, and that no one can produce today. Moore's law isn't dead. We're bringing it back to life.